Ma recherche
Je recherche tout type de contrat, sur toute la région Ile de France, dans le Batiment.
Formations
12/2023 : Bac +5 - INP ENSEEIHT
Master Of Science – Electronic Systems for Embedded and Communicating Applications
12/2019 : Bac +3 - REVA University
Bachelor of Technology – Electronics and Communications
Expériences professionnelles
09/2024 - 11/2024 : Application Engineer – System on Chip chez Arteris Ip, Paris
Provided customer support for Network‑on‑Chip (NoC) solutions, trained on FlexNoC tool, performed architectural analysis and debugging, collaborated with R&D to resolve tool‑related issues, and used AMBA protocols (AXI, AHB, APB, OCP).
02/2023 - 08/2023 : Firmware Engineer - Internship chez Slb (ex - Schlumberger), Paris
Contributed to the design, development, and testing of firmware for logging tools using DSP techniques. Supported the integration and validation of firmware. Collaborated with cross‑functional teams to ensure product quality and performance standards.
Langues
French (Oral : notions / Ecrit : débutant), English (Oral : courant / Ecrit : intermédiaire)
Atouts et compétences
FPGA Design, VHDL Programming, Xilinx Vivado (Nexys A7), Embedded Systems (pic18f, Arduino UNO), Embedded C, MPLAB, UVM, MATLAB, Python, C, HTML, Web3, Microsoft Office Pack, JIRA, FlexNoC, Techlog, Cadence, LTSpice, Advanced Design System (ADS), AI skills - Knowledge of AI agents, LLM, prompting, Self‑motivated, rigorous, autonomous, Interpersonal skills, Technical support - troubleshooting, writing, copywriting